| Mfg Part Number: BAS16 | Manufacturer: Philips Circuit Assemblies | NSN : 5961-01-352-3496 |
| NIIN : 013523496 | Item Name : semiconductor devic | CAGE Code : 25403 |
| FSC : 5961 Semiconductor Devices and Associated Hardware |
We are pleased to announce that the NSN Part BAS16 is currently available for immediate purchase through Alpha NSN. This Semiconductor Devic part is manufactured by Philips Circuit Assemblies and is listed alongside the NSN 5961-01-352-3496. If you are interested in purchasing BAS16 part by Philips Circuit Assemblies, or any other component listed on our website, you may begin the purchasing process with our Instant RFQ service. To begin, simply fill out the RFQ form provided on this page with as much information as possible and click submit. With dedicated account managers readily available for our customers, you will receive a personalized solution within 15 minutes of submission. If you are facing an AOG situation, don't hesitate to contact our team to learn about same-day shipping options on select in-stock items.
Alpha NSN is your number one choice for purchasing high-quality NSN part BAS16, whether they be 5961-01-352-3496 or others. Also, at Alpha NSN, we list every item alongside its respective CAGE Code, such as 25403, allowing customers to cross-reference identifiers as desired. Additionally, as the only independent distributor with a NO CHINA Sourcing policy, we guarantee that every order is fully traceable or comes directly from a trusted manufacturer like Philips Circuit Assemblies. Submit an RFQ today to learn why so many customers rely on Alpha NSN to fulfill all their operational requirements.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-352-3496 Item Description: Semiconductor Devic | 5961 | 013523496 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Bas16 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | PLASTIC |
| ABHP | OVERALL LENGTH | 0.110 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.029 INCHES MINIMUM AND 0.037 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.047 INCHES MINIMUM AND 0.055 INCHES MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT-23 |
| ASKA | COMPONENT NAME AND QUANTITY | 3 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 75.0 MAXIMUM BREAKDOWN VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE |
| FEAT | SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| ABJT | TERMINAL LENGTH | 0.018 INCHES MINIMUM AND 0.024 INCHES MAXIMUM |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 250.00 MILLIAMPERES FORWARD CURRENT, AVERAGE ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE |
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